JOB DETAILS

Microelectronics ASIC Design Engineer

Radiance Technologies • Full-time • Corporate Headquarters, United States of America • 2w ago

Radiance Technologies, a rapidly growing employee-owned company is searching for a talented Microelectronics Research and Development Engineer with ASIC design experience to join our Microelectronics Technology Operation. The candidate should have at least 5 years of ASIC design experience with both digital and analog design flow knowledge. Familiarity with EDA tools for digital place and route as well as analog full custom layout, simulation and parasitic extraction is desired. Full chip assembly knowledge is a plus with experience in pad design, ESD protection, and chip finishing operations for density, and layer fill. The candidate will perform a wide range of tasks in the execution of projects such as requirements definition, selection and acquisition of EDA tools as well as testing materials/equipment, design and performance of experiments, tests, and measurements, communication/coordination with stakeholders through various means including oral, written, and formal presentation, and other research and development tasks in the microelectronic security field.

Required Qualifications:

Bachelor’s degree in electrical engineering or relevant technical field
Silicon foundry experience with process design kits and design flows
Commercial EDA tool experience for ASIC chip assembly
Working knowledge of front-end RTL synthesis and constraints
Backend chip assembly knowledge including DRC/LVS verification
Silicon packaging experience with wire bond and flip chip die attach
PC Board layout and schematic working knowledge
Advanced knowledge of microelectronics micro- and nano-fabrication processes and characterization techniques
Ability to efficiently evaluate and solve problems
Must be self-motivated and work well on a team
Excellent written, oral and presentation skills using Microsoft Office software
US citizenship with the ability to obtain and maintain a security clearance

Desired Qualifications:

Experience in microelectronics and materials characterization fields
Experience in project management using tools such as Jira and Confluence
Experience in mechanical design for 2.5D and 3D chip packaging
Silicon thermal management and heat dissipation
Active Security Clearance

EOE/Minorities/Females/Vet/Disabled

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